Nanoscale conference to identify new technology's top priorities
HOUSTON, March 31, 2005 – Internationally renowned nanotechnology leaders from both industry and academia will meet in Houston for the second Nanoscale Devices & System Integration (NDSI'05) conference April 4-6.
Locally sponsored by the University of Houston Cullen College of Engineering and held at the Warwick Hotel, the NDSI'05 brings together world experts in nanotechnology, offering a high-quality technical program. National sponsors are the National Science Foundation, IEEE Nanotechnology Council, Information Storage Industry Consortium and Nanotechnology Foundation of Texas. Industrial contributors include RHK Technologies and Veeco Instruments, the industry leaders in nanotechnology instrumentation.
"This nationally recognized conference is a chance for UH to step into the spotlight among the world's leading researchers in nanotechnology," said Dmitri Litvinov, UH electrical engineering professor and event co-chair.
NDSI has a single-session format with all the invited talks forming the body of the conference. Contributed work is showcased at the poster sessions. Work presented at the conference will be published in a special issue of IEEE Transactions on Nanotechnology.
The conference will be a highly interactive meeting that will serve as an open forum to identify priorities in today's broad range of nanoscale technologies. Major topics related to device fabrication and synthesis at the nano scale, as well as integration of nanoscale technologies into functional systems, will be covered. Topics include nanoelectronics, nanomagnetics and spintronics, nanophotonics, nano/bio-inspired devices and systems, nanorobotics, materials for nanotechnologies, fabrication for nanoscale and metrology.
Last year's conference in Miami drew more than 160 participants from 14 countries and featured nationally recognized university scholars, as well as scientists and engineers from major corporations such as NEC, IBM, Toshiba, AMD, Samsung, Seagate and Veeco.
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